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Home Page >> Solutions >>Smart Card Chip Bonding >> Non-conductive Hot Melt Film 8835R-50
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Non-conductive Hot Melt Film 8835R-50

     Description

8835R-50 is transparent polyamide hot melt film. It can be use for various kinds of materials bonding and laminating. It can provide very high adhesion strength to epoxy glass fiber sheet, metal, ABS, PVC, PC, PU, Nylon. 8835R-50 also can be used for the Smart Card Chip Bonding. It has been approved and used by the Smart Card factories.

Features

1. 8835R-50 can provide very high adhesion strength and easy to operation.

2. 8835R-50 has stable performance, it is acid and alkali resistant, alcohol resistant, waterproof.

3. 8835R-50 can provide stable adhesion under the high temperature and cold environment.

Properties

Properties

8835R-50

Test Method

Color 

 Transparent   

    Visual

Thickness  

 0.05mm

GB7125-1999

Melting Point 

110±5 

ISO11357-1

Softening Point  

130±5

Ring and ball softening point

Melting Point Index

8±1g/10mins

2KG,160

Recommended Embedding conditions

 

Pre-lamination: 120-140Time 1.0-1.5 Seconds

Implantation: 190Time 0.7-1.0 Seconds

Purpose

18835R-50 can be used for the epoxy glass fiber sheet laminate with metal in the consumer electronic market.

28835R-50 can be used for the faux leather, fabric lamination in consumer electronic market and automotive industry.

       38835R-50 can be used for the Smart Card Chip Bonding application.

     Storage

8835R-50 should be storage under the room temperature 23±5and 50%±5 humidity. Keep it in dry environment. 

Shelf Life6 months

Notice

      The above performance and data are the average test value of the laboratory for reference. If you have any questions about the products and samples support, please contact with us.  www.zhongphoenix.com


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